From wafer-handling systems to rack-mounted test gear and control cabinets, the “brains” may be silicon—but the reliability often comes down to the metalwork around it: rigid structures, clean interfaces, thermal paths, shielding, and serviceable access.
Why metal parts matter in electronics and semiconductor systems
Metal components do more than “hold things together.” They create stiffness and alignment for precision assemblies, provide grounding paths, manage heat, reduce EMI/RFI leakage, and protect sensitive components from handling and the environment.
Structural performance and alignment
Rigid metal structures maintain alignment for PCBs, connectors, optics, and moving subsystems. In precision equipment, small deflections can translate into performance drift or assembly challenges.
Electrical grounding and shielding
Properly designed metal parts create consistent grounding paths and shielding surfaces that help control electromagnetic interference in dense electronic systems.
Thermal and environmental protection
Metal enclosures and plates also serve as thermal paths, helping move heat away from sensitive components while protecting assemblies from handling damage and environmental exposure.
Material selection and finishing expectations
In contamination-sensitive applications, material selection and finishing can also support cleanliness and corrosion resistance expectations common in semiconductor devices.
Cleanliness and corrosion considerations
Smooth surfaces, appropriate finishes, and corrosion-resistant materials help reduce particle generation and simplify cleaning in controlled environments.
Standards and compliance context
Many material and finishing choices align with broader manufacturing and safety expectations outlined by organizations like NIST MEP and OSHA.
Materials and finishes you’ll see most often
Most assemblies blend a few go-to materials with finishes chosen for conductivity, corrosion resistance, appearance, and cleanability.
Common materials
- Aluminum: lightweight, machinable, excellent for thermal management; often anodized
- Stainless steel: corrosion resistance, cleanability; common in harsh/clean environments
- Cold-rolled or galvanized steel: rigidity and cost effectiveness for cabinets/frames
- Copper (select cases): high thermal conductivity for heat spreaders/thermal parts
Typical finishes
Common finishes include anodizing, passivation, plating, and powder coating—selected based on where the part lives (lab vs. fab floor), whether conductivity matters (EMI), and how it will be cleaned/handled.
The 10 most common metal components
Below are ten “repeat offenders” that show up across board-level electronics, test systems, and semiconductor devices—along with what to watch for when you’re designing/spec’ing them.
1) Sheet metal enclosures and instrument housings
These protect electronics, provide mounting, and create grounding/shielding surfaces.
- Watch for: bend radii, PEM hardware placement, door/cover seams, gasket lands
- Common materials: aluminum, CRS, stainless
If you’re building anything from a control box to a bench instrument, enclosure DFM pays off fast.
2) Chassis and subchassis (U-shapes, trays, clamshells)
Chassis parts act like the “skeleton” inside a product, holding PCBs, PSUs, fans, and connectors in precise alignment.
- Watch for: datum strategy, fastener access, serviceability, tolerance stack-up
- Common processes: laser cutting + forming + hardware insertion
3) Mounting brackets, L-brackets, and standoff plates
Simple parts, huge impact—these control alignment, strain relief, and assembly speed.
- Watch for: hole-to-edge distances, slot use for adjustability, deburring requirements
- Pro tip: design bracket families (same thickness/material) to simplify sourcing
4) Front panels, faceplates, and operator interfaces
Front panels carry branding, labeling, cutouts for displays/switches, and often define perceived quality.
- Watch for: cosmetic surface requirements, countersinks, legends/graphics, edge quality
- Consider: anodize + laser marking, or powder coat + silk screening depending on use case
5) EMI/RFI shielding panels and “Faraday cage” features
Metal enclosures and partitions can reduce electromagnetic interference by forming conductive barriers—especially when seams and openings are treated correctly.
- Watch for: conductivity across joints, coating choices, gasket compression
- Common add-ons: conductive gaskets, fingerstock, bonded lids/doors
Industry guidance from groups like the ANSI ecosystem and SME often informs best practices around shielding and assembly.
6) Heat sinks, heat spreaders, and thermal mounting plates
Thermal parts move heat away from hot devices into air or liquid cooling paths, improving reliability and performance.
- Watch for: flatness, surface contact, mounting pattern, airflow direction
- Common materials: aluminum, copper (or hybrid assemblies)
7) Card guides, card cages, and PCB retainers
Especially in rack systems and test equipment, guides and cages keep cards aligned, protected, and serviceable.
- Watch for: insertion/removal ergonomics, tolerances for rail spacing, wear points
- Consider: grounding fingers/bonding where EMI control is important
8) Backplates, baseplates, and stiffeners
These increase rigidity, control vibration, and provide consistent datum surfaces for repeatable assembly.
- Watch for: thickness vs. weight tradeoffs, fastener pull-through, flatness targets
9) Cable management hardware and strain-relief brackets
Cables are a failure mode when ignored—strain relief and routing improve reliability and serviceability.
- Watch for: bend radius, connector clearance, tie-down locations, sharp-edge mitigation
- Add: edge grommets, cable clamps, and protected pass-throughs where needed
10) Cleanroom-adjacent frames, cabinets, and equipment covers
For semiconductor devices, metalwork often extends beyond the “box” into larger structural and protective assemblies.
- Watch for: cleanable geometries, corrosion resistance, repeatable alignment features
- Common materials: stainless, anodized aluminum
Quick design tips to get better parts
If you want smoother fabrication and fewer surprises, these tend to move the needle.
What to figure out early
- Specify the functional requirements first (cosmetic faces, sealing, grounding, flatness)
- Use consistent thicknesses/materials across a family of parts
- Leave room for hardware tools and service access
- Call out deburr and edge-break expectations clearly
- For thermal/shielding parts, define contact areas and acceptable coatings
Align on capabilities up front
For quoting and manufacturability discussions, it also helps to align early on process capabilities like laser cutting and CNC machining.
Build your next electronics or semiconductor assembly
If your product needs tight, repeatable metal parts—enclosures, chassis, brackets, thermal components, frames, or cleanroom-adjacent assemblies—Eagle Metalcraft supports electronics and semiconductor customers with integrated capabilities under one roof.
FAQ
Here are the common questions that come up when engineers are sourcing enclosures, chassis, and precision parts for electronics and semiconductor-adjacent builds for devices.
What’s the difference between a chassis and an enclosure?
A chassis is typically the internal structural frame that holds components, while an enclosure is the outer protective housing. Many products use both, sometimes combined into one formed assembly.
How do I think about EMI shielding in a metal enclosure?
Continuity matters most. Conductive enclosures help block electromagnetic fields, but seams, doors, and penetrations are common leakage points.
When should I use aluminum vs. stainless?
Aluminum is lighter and supports thermal performance, while stainless offers durability, corrosion resistance, and cleanability. The choice depends on environment and handling.
Do heat sinks always need to be custom?
Not always. Standard extrusions work in many cases, but custom mounting patterns or envelopes often require machining.
What information should I include when requesting a quote?
Provide drawings or STEP files, material and finish, quantity, tolerance priorities, and any critical notes around cosmetics, flatness, deburr, or cleanliness.
